Lightwave Logic Announces Publication of U.S. Patent Application for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators
The ability to fabricate polymer modulators using chip-scale techniques aligns the Lightwave technology platform with the chip-scale packaging of consumer silicon electronics, enabling manufacturing simplified at high volume thanks to foundry-level packaging
ENGLEWOOD, Colo. , June 23, 2022 /PRNewswire/ — Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optical polymers to transmit data at higher speeds with less power, announced today now the publication of a U.S. patent application for a new invention that will enable simplified foundry-level packaging of polymer modulators using chip-scale techniques that can be applied at the wafer level, which is essential for high-volume manufacturing applications.
This patent application – titled “Hybrid electro-optic polymer modulator with atomic layer deposition (ALD) sealant layer” with publication number 2022/0187638A1 – allows Lightwave Logic’s proprietary polymers to be moisture and heat sealed. other atmospheric gases at very low temperature and quasi-hermetic environment through the use of a chip-scale conditioning approach that can be applied in parallel at the wafer level (i.e. by volume) and which eliminates the need for a separate hermetic enclosure or “golden box”. Chip-scale packaging is a technique that has gained momentum in the silicon electronics industry over the past decade to reduce chip packaging costs and increase device performance. devices – enabling high volume front-end and back-end manufacturing as well as extremely small sizes in miniaturization.
Over the past two years, Lightwave Logic has optimized its atomic layer deposition techniques to not only seal its polymers in a near hermetic environment, but also to improve both the stability and reliability of the polymer devices, without any adverse effects. on polarization. The sealing process will allow for a lower cost implementation of the system in a high volume foundry environment. Specifically, Lightwave Logics’ electro-optical polymer modulators are sealed with low temperature conformal atomic layer deposition dielectric layers that are supported on a silicon substrate with passive silicon photonic waveguides.
dr. Michael LebbyCEO of Lightwave Logic, said, “We continue to strengthen our intellectual property portfolio, with this particular patent application representing a significant breakthrough for polymer modulator devices in general – allowing them to be miniaturized and packaged using chip-scale packaging techniques. popular in the silicon electronics industry today. The timing of this invention positions us to make polymers truly ubiquitous as we continue to simplify the production of polymer modulators for our foundry partners.
“We are confident in the performance and stability of our polymers and are focusing our R&D efforts on innovative new ways to further simplify the manufacturing efforts of our foundry partners, supporting them as we position our technology platform for the high-volume manufacturing. I look forward to continued operational execution in the months ahead as we strive to create long-term value for our stakeholders.
About Lightwave Logic, Inc.
Lightwave Logic, Inc. (NASDAQ: LWLG) is developing a platform that leverages its proprietary electro-optical (EO) polymers to transmit data at higher speeds with less power. The company’s high-activity, high-stability organic polymers enable Lightwave Logic to create next-generation EO photonic devices, which convert data from electrical signals to optical signals, for applications in the data communications and telecommunications markets. . For more information, please visit the company’s website at lightwavelogic.com.
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