Lightwave Logic Announces Publication of U.S. Patent Application for New Hybrid Photonics to Improve Modulator Manufacturing in High-Volume Foundry Manufacturing

New Patent Application to Simplify Manufacturing of Polymer Modulators Designed to Integrate with Silicon Photonics to Improve Internet Traffic Flow and Reduce Power Consumption

ENGLEWOOD, Colo., April 19, 2022 /PRNewswire/ — Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optical polymers to transmit data at higher speeds with less power, announced today today published a U.S. patent application for a new invention that will simplify the manufacture of polymer modulators when integrated with silicon photonics for high-volume foundry manufacturing applications.

This patent application – entitled “Device and method for optical transition TFP (thin film polymer)” – illustrates the design of a hybrid integrated photonic chip that is easier to manufacture and lower cost using electro-optical polymers that are more advantageous for production. at high volume. The simplified manufacturing approach allows us to simplify the production of very high-speed, low-power, proprietary polymer modulators that will enable significantly faster data rates in the Internet environment.

The essence of the invention is a polymer-silicon hybrid photonic engine that integrates into fiber optic transceivers (pluggable or co-packaged) that are used in routers, servers and proliferating networking equipment with the growth of data centers, cloud computing and optical communications capability. The polymer-silicon hybrid photonic engine is designed to use a high-volume silicon foundry infrastructure and is released under publication number 2022/0113566 A1.

dr. Michael LebbyCEO of Lightwave Logic, said, “This patent application is central to our drive to provide a hybrid integrated photonics platform to improve the performance of silicon photonics technologies using our proprietary electro-optical polymers. The patent application teaches the simplicity of manufacturing the design in standard, high-volume silicon foundries, further simplifying manufacturing for our foundry partners.

“This is another significant addition to our IP portfolio that enables our polymer technology platform to become the powerhouse of pluggable fiber optic transceivers that are used throughout the Internet infrastructure. You you need simplicity and efficiency in chip design for foundries, and this patent application serves that purpose. With this patent application, we are changing the internet and enabling faster data – improving the lives of countless millions of people who depend on the Internet for work, play and communication,” concluded Lebby.

About Lightwave Logic, Inc.
Lightwave Logic, Inc. (NASDAQ: LWLG) is developing a platform that leverages its proprietary electro-optical (EO) polymers to transmit data at higher speeds with less power. The company’s high-activity, high-stability organic polymers enable Lightwave Logic to create next-generation EO photonic devices, which convert data from electrical signals to optical signals, for applications in the data communications and telecommunications markets. . For more information, please visit the company’s website at lightwavelogic.com.

Safe Harbor Statement
Information in this release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify such statements by the words “may”, “will”, “should”, “plans”, “explore ‘, ‘plans’, ‘anticipates’, ‘continues’, ‘estimates’, ‘plans’, ‘intends’ and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, lack of available financing; general economic and commercial conditions; competition from third parties; the intellectual property rights of third parties; regulatory constraints ; changes in technology and marketing methods; delays in the completion of various engineering and manufacturing programs; changes in customer ordering habits; changes in product range; success in technological advances and the delivery of technological innovations; component shortages; production delays due to performance quality issues with outsourced components; the events and factors that we describe in Section 1.A “Risk Factors” of our most recent Form 10-K; other risks to which our Company is subject; other factors beyond the company’s control.

Contact with Investor Relations:
Greg Falesnik or Luke Zimmerman
MZ Group – MZ North America
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[email protected]
www.mzgroup.us

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